Engineering capacity, where the plan outruns the team.
Process, equipment, design and data engineers, as individuals, teams or work packages. We say plainly what we deliver and what a partner delivers.
- Delivered by
- FabBeyond and named partners
- For
- CTOs, engineering directors, technical leads
- Models
- Expert on call, embedded engineers, work package
- Covers
- Design, process, equipment, automation, data
01 Who does what
Two columns. No grey area.
What our own people do, and what we scope, govern and deliver with a named partner.
Our own people
- Engineering talent and augmentationProcess, equipment, facilities, test and design engineers in your team.
- Process and equipment supportInstall, qualification, sustaining and improvement work.
- Technical project managementTool-install, qualification and transfer projects.
- Scoping and governing partner workWe write the scope and stay accountable for delivery.
With a named partner
- Physical design and EDA executionRTL-to-GDSII, verification and DFT by design-service partners.
- Automation and integrationManufacturing systems and equipment integration.
- AI and data-analytics buildsData platforms, fault detection and yield models.
- Facility and hook-up engineeringDesign and execution by licensed contractors.
Partners are named in your proposal before you sign, and one FabBeyond lead stays accountable for the whole scope.
02 Where the work sits
From the transistor to the bond pad.
Design engineers draw it, process engineers build it layer by layer, equipment engineers keep the tools that make it in spec.
- 1Silicon substrate. The wafer itself, with doped wells.
- 2Transistors. The switches, built into the wafer surface.
- 3Contacts. Tungsten plugs from transistors to the first metal.
- 4Local wiring. The finest metal lines, linking nearby transistors.
- 5Intermediate wiring. Routes signals across blocks of the chip.
- 6Global wiring. Thick top layers carry power and long signals.
- 7Vias. Vertical copper plugs between metal layers.
- 8Passivation. A hard layer that seals the finished die.
- 9Bond pad. Where the chip meets its package, here by wire.
03 Coverage
Four domains, from tape-out to tested part.
Design and verification
- Digital and analog design
- Verification and DFT
- Physical design
- EDA flows, via partners
Process engineering
- Process integration
- Litho, etch, films, diffusion, polish
- Die attach, bonding, molding
- Test and product engineering
Equipment and facilities
- Install and qualification
- Maintenance and reliability
- Sub-fab, gas, chemical, water
- Field service for suppliers
Automation, AI and data
- Process control and yield analysis
- Factory systems and automation
- Data engineering
- Machine-learning use cases
04 Engagement models
Three sizes of help.
Expert on call
One senior engineer for days or weeks: a review, a second opinion, a stuck problem.
Ends when the question is answered.
Embedded engineers
Individuals or a small team inside your organisation for a project or ramp phase.
Ends at the milestone, or you hire them.
Work package
Defined scope, deliverables and acceptance criteria, by us or a named partner.
Ends at acceptance.
Every engineer we propose is interviewed by a practitioner from the same discipline, and you get the notes. The screening flow.
05 Questions
Engineering services, answered plainly.
Which engineering services does FabBeyond deliver directly?
Engineering talent and resource augmentation, process and equipment engineering support through experienced engineers placed in your team, technical project management, and the scoping and governance of any partner work.
Does FabBeyond provide physical design and EDA services?
FabBeyond supplies design, verification and physical-design engineers directly as talent. Complete physical-design and EDA-related execution is delivered through qualified design-service partners, who are named in the proposal.
Can you supply engineers for tool installation and qualification?
Yes. We place install, qualification, process and equipment engineers as individuals or as a project crew sized to the milestone. Hook-up design and execution itself is done by licensed specialist contractors.
How quickly can engineers be deployed?
It depends on the discipline, the seniority and notice periods. After scoping we give you a dated plan showing who can start when, and we say so if a role will be slow to fill.
What does resource augmentation mean in a semiconductor project?
It means adding engineers to your own team for a defined period, under your management, to cover a peak in workload or a skill you do not yet have in-house. It is different from a work package, where the provider owns a deliverable.
Next step
What is your next semiconductor challenge?
Tell us what you are solving. We will tell you plainly whether we can help, and who would deliver it.